Siemens is joining forces with Universities and Research Institutes to forrm a research partnership.Weiterlesen
The partners of Campus FES emphasize once more that science and industry are to work hand in hand to tackle the challenges of tomorrowWeiterlesen
In December 2013, the Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), the Fraunhofer Institute for Integrated Systems and Device Technology IISB and the Siemens AG founded the Campus „Future Energy Systems“. It serves as a common platform for the research partnership. The goal of the partnership is to increase sustainability, reliability as well as cost effectiveness of future energy systems.
Partnership Agreement between FAU and Siemens
Within the framework of the agreement, we tackle tomorrow’s challenges. By developing comprehensive innovations in the field of process- and systems engineering, we contribute to the energy system transformation. Market-ready solutions are either integrated into the Siemens portfolio or transformed into start-up businesses. Bilateral research as well as public funded research and projects together with Siemens customers are carried out. Furthermore, we elaborate position papers on topics such as power supply and the energy market as recommendations for government policy and society. Within the scope of Campus FES activities, extensive Ph.D. and Post-Doc programs are in place to promote Germany as a business and science location.
Campus „Future Energy Systems“ as an outstanding research collaboration
Besides FAU and the Siemens Corporate Technology, further partners of the Campus FES are: Technische Hochschule Nürnberg Georg Simon Ohm (ELSYS Institut für leistungselektronische Systeme), Helmholtz-Gemeinschaft, Bayerisches Zentrum für Angewandte Energieforschung (ZAE Bayern) and the Energie Campus Nürnberg (EnCN). The first batch of research topics were „green synthesis of chemical energy carriers by means of renewable energy“, “Plasma gasification of biomass”, “Energy storage technologies”, “Power electronics and converters”, and “Energy efficient drives and generators”.
In a continuous race for higher productivity in combination with a need for reduced time to market electronics production in times of Industry 4.0 has to handle four major challenges:
1. Made to order at high mix low volume
As seen in consumer markets, the demand for personalized goods will merge into the industrial electronics sector. Electronic manufacturers will streamline their complete supply and value chain to offer increasingly agile services and solutions. Additive manufacturing will also be used throughout the assembly and test processes to realize on-demand customer specific production.
2. Big Data vs. Smart Data
Smart Data technology will be used to permanently monitor the performance of every process and piece of equipment within the production area to ensure that processes are under control and minimize failures. Based upon the data and the deployment of artificial intelligence closed loops will keep the processes in the required tolerances. Should a failure occur, the machine will have already alerted the production team as well as the equipment supplier responsible for maintenance and required spare parts will have been ordered.
3. Smart Technologies and Materials
Intelligence will be built into electronic and electro-mechanical assemblies – the printed circuit board. Along with the part number of the bare board, build documentation for the final assembly will be stored in the circuit itself. As the product passes through the stages of production, operators will be able to call up the next set of construction guidance relevant to their work.
4. Collaborative Working
A much greater use of collaborative robots (co-bots) will appear within the production. Electronic manufacturers have started to invest heavily in co-bots and the use in a wide range of applications will increase massively. Co-Bots offer high flexibility in automation, rather low invest and short set-up times. Examples of their use will include loading of SMT* components onto feeders and ‘hand placing’ components that cannot be picked by SMT equipment.
There is currently no clear, consistent understanding of terms such as digital platform, platform economy, platform business models or IoT platform. In end-user-related application areas (B2C), so-called “platforms” are the basis for successful applications, new business models and disruption.
To what extent, however, strategies, concepts and solutions can be transferred from the B2C sector to the B2B sector must be fundamentally questioned. B2C platform applications are strongly characterized by many one-off transactions that are brokered via platforms, while business relationships in B2B are more characterized by “long-lasting” rather than “ad hoc” relationships.
The objective is a systematic search and delineation of relevant terminology mentioned in the context of digital platforms, and a precise definition of the different types of platforms and the corresponding scope und demarcation. On this basis, the added value of platforms in the B2B area in form of a value proposition is to be worked out and explained based on successful platform solutions observable in the market.
Future of Power-Electronics - Cause-and-Effect Chain
Power-electronics of today is strongly affected by three fundamental trends:
Worldwide electrification and automation
Reduction of energy consumption and CO2-Emission
Miniaturization by high degree integration
This leads to severe demands on power-electronics with regards to improved reliability, increased efficiency, additional functionalities associated with an increase in power density and challenges for the thermal management. Power-modules are the core of power-electronic devices like an inverter for motor/drive applications or for power converters.
Future packaging and assembly technologies of power-modules have to fulfill the increased requirements like improved power- and temperature cycling stability, low inductive interconnects and improved temperature stability. In the end this has clearly consequences for the right technology and manufacturing approaches. So future development work will focus on topics like improved CTE-adaption, copper as preferred material instead of aluminum, interconnects without bondwires, the application of Wide-Bandgap-Semiconductors, thermal management, high-temperature materials for packaging and assembly and new functionalities like condition monitoring